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| M Features * Inductorless, Buck/Boost, DC/DC Converter * Low Power: 80 A (Typical) * High Output Voltage Accuracy: - 2.5% (VOUT Fixed) * 120 mA Output Current * Wide Operating Temperature Range: - -40C to +85C * Thermal Shutdown and Short-Circuit Protection * Uses Small Ceramic Capacitors * Switching Frequency: - MCP1252: 650 kHz - MCP1253: 1 MHz * Low Power Shutdown Mode: 0.1 A (Typical) * Shutdown Input Compatible with 1.8V Logic * VIN Range: 2.0V to 5.5V * Selectable Output Voltage (3.3V or 5.0V) or Adjustable Output Voltage * Space-saving, 8-Lead MSOP * Soft-Start Circuitry to Minimize In-Rush Current MCP1252/3 Description The MCP1252/3 are inductorless, positive-regulated charge pump DC/DC converters. The devices generate a regulated fixed (3.3V or 5.0V) or adjustable output voltage. They are specifically designed for applications requiring low noise and high efficiency and are able to deliver up to 120 mA output current. The devices allow the input voltage to be lower or higher than the output voltage, by automatically switching between buck/ boost operation. The MCP1252 has a switching frequency of 650 kHz, avoiding interference with sensitive IF bands. The MCP1253 has a switching frequency of 1 MHz and allows the use of smaller capacitors than the MCP1252, thus saving board space and cost. Both devices feature a power-good output that can be used to detect out-of-regulation conditions. Extremely low supply current and low external parts count (three capacitors) make these devices ideal for small, batterypowered applications. A shutdown mode is also provided for further power reduction. The MCP1252 and MCP1253 feature thermal and short-circuit protection and are offered in space-saving, 8-lead, MSOP packages. Low Noise, Positive-Regulated Charge Pump Applications * * * * * * * White LED Backlighting Color Display Bias Local 3V-to-5V Conversions Flash Memory Supply Voltage SIM Interface Supply for GSM Phones Smart Card Readers PCMCIA Local 5V Supplies Package Types MSOP (FIXED) PGOOD V OUT VIN GND 1 2 3 4 8 SELECT SHDN C+ C- MCP1252 MCP1253 7 6 5 MSOP (ADJUSTABLE) PGOOD VOUT VIN GND 1 2 MCP1252 3 MCP1253 4 8 7 6 5 FB SHDN C+ C- 2002 Microchip Technology Inc. DS21752A-page 1 MCP1252/3 Functional Block Diagram MCP1252-33X50 MCP1253-33X50 PGOOD + 84 mV 1.21V + VOUT 200 mV Switch Control VIN GND PGOOD + VOUT 200 mV Switch Control VIN GND DS21752A-page 2 + + + + + 140 k 173 k SELECT 100 k + SHDN C+ C- MCP1252-ADJ MCP1253-ADJ FB 84 mV 1.21V + + + SHDN C+ C- 2002 Microchip Technology Inc. MCP1252/3 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE Name PGOOD VOUT VIN GND CC+ SHDN SELECT FB Function Open-Drain Power GOOD Output Regulated Output Voltage Power Supply Input Ground Terminal Flying Capacitor Negative Terminal Flying Capacitor Positive Terminal Shutdown Mode, Active-Low Input Output Voltage Select Pin. (MCP1252-33X50, MCP1253-33X50) Feedback Input Pin for Adjustable Output (MCP1252-ADJ, MCP1253-ADJ) Absolute Maximum Ratings Power Supply Voltage, VIN ...............................................6.0V Voltage on Any Pin w.r.t. GND ............... -0.3V to (VIN + 0.3V) Output Short Circuit Duration ................................continuous Storage Temperature Range.........................-65C to +150C Ambient Temperature with Power Applied ....-55C to +125C Junction Temperature ................................................. +150C ESD Ratings: Human Body Model (1.5 k in Series with 100 pF ...... 4 kV Machine Body Model (200 pF, No Series Resistance 400V Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are specified for TA = -40C to +85C, SHDN = VIN, CIN = COUT = 10 F, CFLY = 1 F, IOUT = 10 mA. Typical values are for TA = +25C. Parameters Supply Voltage Output Voltage Accuracy Output Current SELECT Logic Input Voltage High Supply Voltage Output Voltage Accuracy Output Current SELECT Logic Input Voltage Low Supply Voltage Output Voltage Adjustment Range FB Regulation Voltage ALL DEVICES Supply Current Output Short-Circuit Current Shutdown Current Power Efficiency IDD ISC ISHDN -- -- -- -- 60 200 0.1 81 68 -- -- 0.93VOUT 0.04VOUT 120 -- 2.0 -- A mA A % % V V V V No load VOUT = GND, foldback current SHDN = 0V VIN = 3.0V, VOUT = 5V VIN = 3.6V, VOUT = 5V IOUT =120 mA Sym VIN VOUT IOUT VIH VIN VOUT IOUT VIL VIN VOUT V FB Min 2.1 -2.5 80 120 1.4 2.7 -2.5 40 120 -- 2.0 1.5 1.18 Typ -- +/-0.5 100 150 -- -- +/-0.5 80 150 -- -- -- 1.21 Max 5.5 +2.5 -- -- 5.5 +2.5 -- 0.4 5.5 5.5 1.24 Units V % mA mA V V % mA mA V V V V VOUT(MAX) < 2 x VIN MCP1252-ADJ, MCP1253-ADJ 2.7V VIN < 3.0V, IOUT 40 mA 3.0V VIN 5.5V, IOUT 120 mA 2.7V VIN < 3.0V 3.0V VIN 5.5V MCP1252-33X50, MCP1253-33X50 2.3V VIN < 2.5V, IOUT 80 mA 2.5V VIN 5.5V, IOUT 120 mA 2.3V VIN < 2.5V 2.5V VIN 5.5V MCP1252-33X50, MCP1253-33X50 Conditions Selectable Output - MCP1252-33X50, MCP1253-33X50: SELECT = VIN, VOUT = 3.3V Selectable Output - MCP1252-33X50, MCP1253-33X50: SELECT = GND, VOUT = 5.0V Adjustable Output - MCP1252-ADJ, MCP1253-ADJ SHDN Logic Input Voltage Low SHDN Logic Input Voltage High PGOOD Threshold Voltage PGOOD Hysteresis 2002 Microchip Technology Inc. VIL VIH VTH VHYS -- 1.4 -- -- 0.4 -- -- -- DS21752A-page 3 MCP1252/3 AC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are specified for TA = -40C to +85C, VIN = 2.7V to 5.5V, SELECT = GND, SHDN = VIN, CIN = C OUT = 10 F, C FLY = 1 F, IOUT = 10 mA. Typical values are for TA = +25C. Parameters Internal Oscillator Frequency Ripple Voltage Sym FOSC VRIP Min 520 800 -- -- Typ 650 1000 50 45 200 300 Max 780 1200 -- -- Units kHz kHz mVp-p mVp-p sec sec Conditions MCP1252 MCP1253 MCP1252 MCP1253 SELECT = VIN SELECT = GND VIN = 3.6V, IOUT = 10 mA, SHDN = VIH(MIN), VOUT from 0 to 90% Nominal Regulated Output Voltage VOUT Wake-Up Time From Shutdown TWKUP TEMPERATURE SPECIFICATIONS Parameters Temperature Ranges: Specified Temperature Range Maximum Operating Junction Temperature Storage Temperature Range Thermal Package Resistances: Thermal Resistance, 8 Pin MSOP JA -- 206 -- C/W Single-Layer SEMI G42-88 Board, Natural Convection TA TJ TA -40 -- -65 -- -- -- +85 +125 +150 C C C Symbol Min Typ Max Units Conditions DS21752A-page 4 2002 Microchip Technology Inc. MCP1252/3 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = 3.6V, TA = 25C, C IN = COUT = 10 F, CFLY = 1 F, all capacitors X7R ceramic. 5.05 Output Voltage (V) 5.04 5.03 5.02 5.01 5.00 4.99 2.0 2.5 3.0 3.5 4.0 10 mA 80 mA 120 mA MCP1252-33X50 SELECT = GND VOUT = 5.0V 4.5 5.0 5.5 6.0 Percent Efficiency (%) 100 90 80 70 60 50 40 30 20 10 0 2.0 2.5 3.0 3.5 4.0 10 mA 80 mA 120 mA MCP1252-33X50 SELECT = GND VOUT = 5.0V 4.5 5.0 5.5 6.0 Supply Voltage (V) Supply Voltage (V) FIGURE 2-1: Output Voltage vs. Supply Voltage (MCP1252-33X50). . FIGURE 2-4: Percent Efficiency vs. Supply Voltage (MCP1252-33X50). 3.34 Power Efficiency (%) Output Voltage (V) 3.33 80 mA 120 mA 3.32 3.31 2.0 MCP1252-33X50 SELECT = VIN VOUT = 3.3V 2.5 3.0 3.5 4.0 4.5 10 mA 100 90 80 70 60 50 40 30 20 10 0 2.0 2.5 10 mA 80 mA 120 mA MCP1252-33X50 SELECT = VIN VOUT = 3.3V 3.0 3.5 4.0 4.5 5.0 5.5 6.0 5.0 5.5 6.0 Supply Voltage (V) Supply Voltage (V) FIGURE 2-2: Output Voltage vs. Supply Voltage (MCP1252-33X50). FIGURE 2-5: Power Efficiency vs. Supply Voltage (MCP1252-33X50). 3.02 Power Efficiency (%) Output Voltage (V) 3.01 10 mA 80 mA 120 mA MCP1252-ADJ VOUT = 3.0V 3.5 4.0 4.5 5.0 5.5 6.0 3.00 2.99 1.5 2.0 2.5 3.0 100 90 80 70 60 50 40 30 20 10 0 1.5 2.0 2.5 10 mA 80 mA 120 mA MCP1252-ADJ VOUT = 3.0V 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) Supply Voltage (V) FIGURE 2-3: Output Voltage vs. Supply Voltage (MCP1252-ADJ). FIGURE 2-6: Power Efficiency vs. Supply Voltage (MCP1252-ADJ). 2002 Microchip Technology Inc. DS21752A-page 5 MCP1252/3 Note: Unless otherwise indicated, VIN = 3.6V, TA = 25C, CIN = COUT = 10 mF, C FLY = 1 mF, all capacitors X7R ceramic. 5.03 Output Voltage (V) 5.02 5.01 5.00 4.99 4.98 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (C) Supply Current (uA) MCP1253-33X50 80 75 70 65 60 55 50 45 40 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (C) VIN = 2.3V MCP1253-33X50 SELECT = GND VOUT = 5.0V, IOUT = 0 mA VIN = 5.5V VIN = 3.6V VIN = 2.7V MCP1252-33X50 SELECT = GND VOUT = 5.0V IOUT = 120 mA FIGURE 2-7: Output Voltage vs. Temperature (MCP1252-33X50, MCP1253-33X50). 3.33 FIGURE 2-10: Quiescent Current vs. Temperature (MCP1253-33X50). 80 Supply Current (uA) MCP1253-33X50 MCP1252-33X50 SELECT = VIN VOUT = 3.3V IOUT = 120 mA 75 70 65 60 55 50 45 40 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (C) VIN = 5.5V VIN = 3.6V Output Voltage (V) 3.32 3.31 3.30 3.29 3.28 VIN = 2.7V VIN = 2.3V MCP1252-33X50 SELECT = GND VOUT = 5.0V, IOUT = 0 mA -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (C) FIGURE 2-8: Output Voltage vs. Temperature (MCP1252-33X50, MCP1253-33X50). FIGURE 2-11: Quiescent Current vs. Temperature (MCP1252-33X50). FIGURE 2-9: Line Transient Response. FIGURE 2-12: Load Transient Response. DS21752A-page 6 2002 Microchip Technology Inc. MCP1252/3 Note: Unless otherwise indicated, VIN = 3.6V, TA = 25C, CIN = COUT = 10mF, CFLY = 1mF, all capacitors X7R ceramic. 70 60 50 40 30 20 10 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) 80 mA 10 mA 120 mA MCP1252-33X50 SELECT = GND VOUT = 5.0V FIGURE 2-13: Output Voltage Ripple vs. Supply Voltage (MCP1252-33X50). 70 Output Voltage Ripple (mV) 60 50 40 30 20 10 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) 120 mA 80 mA 10 mA MCP1252-33X50 SELECT = VIN VOUT = 3.3V Output Voltage Ripple (mV) FIGURE 2-16: Time. Output Voltage Ripple vs. FIGURE 2-14: Output Voltage Ripple vs. Supply Voltage (MCP1252-33X50). FIGURE 2-17: Time. Output Voltage Ripple vs. FIGURE 2-15: Start-Up (MCP1252-33X50). FIGURE 2-18: Start-Up (MCP1253-33X50). 2002 Microchip Technology Inc. DS21752A-page 7 MCP1252/3 3.0 PIN FUNCTIONS PIN FUNCTION TABLE Function 3.6 Flying Capacitor Positive Terminal (C+) TABLE 3-1: Pin No. 1 2 3 4 5 6 7 8 Name The charge pump capacitor (flying capacitor) is used to transfer charge from the input supply to the regulated output. Proper orientation is imperative when using a polarized capacitor. PGOOD Open-Drain Power GOOD Output VOUT VIN GND CC+ SHDN Regulated Output Voltage Power Supply Input Ground Terminal Flying Capacitor Negative Terminal Flying Capacitor Positive Terminal Shutdown Mode, Active-Low Input (MCP1252-33X50, MCP1253-33X50) 3.7 Shutdown Input (SHDN) A logic-low signal applied to SHDN disables the device. A logic-high signal applied to this pin allows normal operation. 3.8 SELECT Output Voltage Select Pin. FB Feedback Input Pin for Adjustable Output (MCP1252-ADJ, MCP1253-ADJ) Select (SELECT) Input or Feedback (FB) Input MCP1252-33X50, MCP1253-33X50: SELECT: Select Input Pin. Connect SELECT to VIN for 3.3V fixed output. Connect SELECT to GND for a 5.0V fixed output. MCP1252-ADJ, MCP1253-ADJ: FB: Feedback Pin. A resistor divider connected to this pin determines the adjustable V OUT value (1.5V to 5.5V). 3.1 Open-Drain Power Good Output (PGOOD) PGOOD is a high-impedance when the output voltage is in regulation. A logic-low is asserted when the output falls 7% (typical) below the nominal value. The PGOOD output remains low until VOUT is within 3% (typical) of its nominal value. On start-up, this pin indicates when the output voltage reaches its final value. PGOOD is high-impedance when SHDN is low. 3.2 3.3 Regulated Output Voltage (VOUT) Power Supply Input (VIN) Bypass to GND with a filter capacitor. It is recommended that VIN be tied to a ceramic bypass capacitor. 3.4 Ground (GND) It is recommended that the ground pin be tied to a ground plane for best performance. 3.5 Flying Capacitor Negative Terminal (C-) The charge pump capacitor (flying capacitor) is used to transfer charge from the input supply to the regulated output. It is recommended that a low ESR (equivalent series resistance) capacitor be used. DS21752A-page 8 2002 Microchip Technology Inc. MCP1252/3 4.0 4.1 DEVICE OVERVIEW Theory of Operation START The MCP1252 and MCP1253 family of devices employ a switched capacitor charge pump to buck or boost an input supply voltage (VIN) to a regulated output voltage. Referring to the Functional Block Diagram and Figure 4-1, the devices perform conversion and regulation in three phases. When the devices are not in shutdown mode and a steady-state condition has been reached, the three phases are continuously cycled through. The first phase transfers charge from the input to the flying capacitor (CFLY) connected to pins C+ and C-. This phase always occurs for half of the internal oscillator period. During this phase, switches S1 and S2 are closed. Once the first phase is complete, all switches are opened and the second phase (idle phase) is entered. The device compares the internal or external feedback voltage with an internal reference. If the feedback voltage is below the regulation point, the device transitions to the third phase. The third phase transfers energy from the flying capacitor to the output capacitor connected to VOUT and the load. If regulation is maintained, the device returns to the idle phase. If the charge transfer occurs for half the internal oscillator period, more charge is needed in the flying capacitor and the device transitions back to the first phase. The regulation control is hysteretic, otherwise referred to as a bang-bang control. The output is regulated around a fixed reference with some hysteresis. As a result, typically 50 mV of peak-to-peak ripple will be observed at the output independent of load current. The frequency of the output ripple, however, will be influenced heavily by the load current and output capacitance. The maximum frequency that will be observed is equal to the internal oscillator frequency. The devices automatically transition between buck or boost operation. This provides a low-cost, compact and simple solution for step-down/step-up DC/DC conversion. This is especially true for battery-operated applications that require a fixed output above or below the input. PHASE 1: Charge Transfer From VIN to C FLY No 1 t1 = 2FOSC Yes PHASE 2: Idle State VFB > VREF No PHASE 3: Charge Transfer From CFLY to COUT Yes 1 t3 = 2FOSC No No VFB > VREF Yes Yes FIGURE 4-1: Flow Algorithm. 2002 Microchip Technology Inc. DS21752A-page 9 MCP1252/3 4.2 Power Efficiency 4.6 Thermal Shutdown The power efficiency, , is determined by the mode of operation. In boost mode, the efficiency is approximately half of a linear regulator. In buck mode, the efficiency is approximately equal to that of a linear regulator. The following formulas can be used to approximate the power efficiency with any significant amount of output current. At light loads, the quiescent current of the device must be taken into consideration. The MCP1252 and MCP1253 feature thermal shutdown with temperature hysteresis. When the die temperature exceeds 160C, typically, the device shuts down. When the die cools by 15C, typically, the device automatically turns back on. If high die temperature is caused by output overload and the load is not removed, the device will turn on and off, resulting in a pulse output. EQUATION P OUT V OUT V O UT x I OU T = ------------- = ------------------------------------ = ----------------V IN x 2 x I O UT P IN V IN x 2 5.0 APPLICATIONS BOOST P OUT V OU T V OU T x I OUT BUCK = ------------- = ------------------------------- = ------------V IN x I OU T P IN V IN The MCP1252 and MCP1253 are inductorless, positive regulated, charge pump DC/DC converters. A typical circuit configuration for the fixed output version is depicted in Figure 5-1. The adjustable version is depicted in Figure 5-2. SELECTABLE OUTPUT VOLTAGE 6 MCP1252-33X50 C+ C1 8 PGOOD Flag To PICmicro(R) Microcontroller CFLY = 1 F CIN = 10 F COUT = 10 F RPU = 100 k +5.0V 2.5% V OUT 2 + 4.3 Shutdown Mode CFLY 2.7V to 5.5V + 5 Driving SHDN low places the MCP1252 or MCP1253 in a low power shutdown mode. This disables the charge pump switches, oscillator and control logic, reducing the quiescent current to 0.1 A (typical). The PGOOD output is in a high-impedance state during shutdown. RPU PGOOD SELECT GND COUT 3V IN 7 CIN SHDN 4 ON OFF Shutdown Control 4.4 PGOOD Output The PGOOD output is an open-drain output that sinks current when the regulator output voltage falls below 0.93VOUT (typical). The output voltage can either be fixed when the selectable output device is chosen (MCP1252-33X50, MCP1253-33X50) or adjustable from an external resistive divider when the adjustable device is chosen (MCP1252-ADJ, MCP1253-ADJ). If the regulator output voltage falls below 0.93V OUT (typical) for less than 200 sec and then recovers, glitchimmunity circuits prevent the PGOOD signal from transitioning low. A 10 k to 1 M pull-up resistor from PGOOD to VOUT may be used to provide a logic output. Connect PGOOD to GND or leave unconnected if not used. FIGURE 5-1: Typical Circuit Configuration for Fixed Output Device. ADJUSTABLE OUTPUT VOLTAGE 6 CFLY 2.7V to 5.5V CIN + MCP1252-ADJ C+ CPGOOD 1 FB 8 VOUT 2 +4.0V RPU R1 PGOOD Flag To PICmicro(R) Microcontroller R2 CFLY = 1 F CIN = 10 F COUT = 10 F RPU = 100 k R1 = 23.2 k R2 = 10 k + COUT 5 3V IN 7 4.5 Soft-Start and Short-Circuit Protection ON OFF Shutdown Control The MCP1252 and MCP1253 features foldback shortcircuit protection. This circuitry provides an internal soft-start function by limiting in-rush current during startup and also limits the output current to 200 mA (typical) if the output is shorted to GND. The internal soft-start circuitry requires approximately 300 sec, typical with a 5V output, from either initial power-up or release from shutdown for the output voltage to be in regulation. SHDN GND 4 VOUT = 1.21V (1 + R1/R2) FIGURE 5-2: Typical Circuit Configuration for Adjustable Output Device. DS21752A-page 10 2002 Microchip Technology Inc. MCP1252/3 5.1 Capacitor Selection The style and value of capacitors used with the MCP1252 and MCP1253 family of devices determine several important parameters such as output voltage ripple and charge pump strength. To minimize noise and ripple, it is recommended that low ESR (0.1 ) capacitors be used for both CIN and COUT. These capacitors should be either ceramic or tantalum and should be 10 F or higher. Aluminum capacitors are not recommended because of their high ESR. If the source impedance to VIN is very low, up to several megahertz, C IN may not be required. Alternatively, a somewhat smaller value of CIN may be substituted for the recommended 10 F, but will not be as effective in preventing ripple on the VIN pin. The value of C OUT controls the amount of output voltage ripple present on VOUT. Increasing the size of COUT will reduce output ripple at the expense of a slower turn-on time from shutdown and a higher in-rush current. The flying capacitor (CFLY) controls the strength of the charge pump. In order to achieve the maximum rated output current (120 mA), it is necessary to have at least 1 F of capacitance for the flying capacitor. A smaller flying capacitor delivers less charge per clock cycle to the output capacitor, resulting in lower output ripple. The output ripple is reduced at the expense of maximum output current and efficiency. Note that the tolerance of the external resistors will have an effect on the accuracy of the output voltage. For optimum results, it is recommended that the external resistors have a tolerance no larger than 1%. 5.3 Recommended Layout The MCP1252 and MCP1253 family of devices transfer charge at high switching frequencies, producing fast, high peak, transient currents. As a result, any stray inductance in the component layout will produce unwanted noise in the system. Proper board layout techniques are required to ensure optimum performance. Figure 5-3 depicts the recommended board layout. The input capacitor connected between VIN and GND, and the output capacitor connected between VOUT and GND, are 10 F ceramic, X7R dielectric, in 1206 packages. The flying capacitor connected between C+ and C- is a 1 F ceramic, X7R dielectric in a 0805 package. The layout is scaled 3:1. PGOOD VOUT SELECT SHDN C+ GND VIN C- 5.2 Output Voltage Setting The MCP1252-33X50 and MCP1253-33X50 feedback controllers select between an internally-set, regulated output voltage (3.3V or 5.0V). Connect SELECT to GND for a regulated 5.0V output and connect SELECT to VIN for a regulated 3.3V output. The MCP1252-ADJ and MCP1253-ADJ utilize an external resistor divider that allows the output voltage to be adjusted between 1.5V and 5.5V. For an adjustable output, connect a resistor between VOUT and FB (R1) and another resistor between FB and GND (R 2). In the following equation, choose R2 to be less than or equal to 30 k and calculate R1 from the following formula: FIGURE 5-3: Recommended Printed Circuit Board Layout. EQUATION R 1 = R [( V V ) - 1] 2 OUT FB and EQUATION V OUT = VFB ( 1 + R 1 R 2 ) where: VOUT is the desired output voltage from 1.5V to 5.5V VFB is the internal regulation voltage, nominally 1.21V 2002 Microchip Technology Inc. DS21752A-page 11 MCP1252/3 6.0 TYPICAL APPLICATION CIRCUITS Single Cell Lithium-Ion Battery To 5V Converter 1 F 5 C3 Single Li-Ion Cell + 10 F 100 k 7 1 VIN SHDN PGOOD 6 C+ VOUT SELECT GND 2 8 4 10 F 5V MCP1252-33X50 White LED Bias 1 F 5 C3 Single Li-Ion Cell + 10 F 100 k 7 1 VIN SHDN PGOOD 6 C+ VOUT SELECT GND 2 8 4 UP TO 6 WHITE LEDS 10 F 59 59 59 59 59 59 PWM Contrast Control MCP1252-ADJ Alternative White LED Bias 1 F 5 C3 Single Li-Ion Cell + 10 F 100 k 7 1 V IN SHDN PGOOD 6 C+ VOUT SELECT GND 2 8 4 UP TO 6 WHITE LEDS 10 F 24 k 10 k 10 10 10 10 10 10 PWM Contrast Control MCP1252-ADJ DS21752A-page 12 2002 Microchip Technology Inc. MCP1252/3 7.0 7.1 PACKAGING INFORMATION Package Marking 8-Lead MSOP (Fixed) Example: XXXXX YWWNNN 1252SX 233025 8-Lead MSOP (Adjustable) Example: XXXXX YWWNNN 1253DJ 233025 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. 2002 Microchip Technology Inc. DS21752A-page 13 MCP1252/3 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 A c A1 A2 (F) L Units Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint (Reference) Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom *Controlling Parameter Significant Characteristic Notes: Dimension Limits n p A A2 A1 E E1 D L F c B .030 .002 .184 .114 .114 .016 .035 0 .004 .010 MIN INCHES NOM 8 .026 .044 .034 .193 .118 .118 .022 .037 .006 .012 7 7 .038 .006 .200 .122 .122 .028 .039 6 .008 .016 MAX MIN MILLIMETERS* NOM 0.65 1.18 0.76 0.05 4.67 2.90 2.90 0.40 0.90 0 0.10 0.25 0.15 0.30 7 7 4.90 3.00 3.00 0.55 0.95 0.86 0.97 0.15 .5.08 3.10 3.10 0.70 1.00 6 0.20 0.40 MAX 8 Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Drawing No. C04-111 DS21752A-page 14 2002 Microchip Technology Inc. MCP1252/3 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) b) Pump Pump Pump Pump Device: MCP1252: Low Noise, Positive-Regulated Charge MCP1252T: Low Noise, Positive-Regulated Charge (Tape and Reel) MCP1253: Low Noise, Positive-Regulated Charge MCP1253T: Low Noise, Positive-Regulated Charge (Tape and Reel) I = -40C to +85C c) MCP1252-33X50I/MS: Low Noise, PositiveRegulated Charge Pump, Fixed Output MCP1252-ADJI/MS: Low Noise, PositiveRegulated Charge Pump, Adjustable Output MCP1252T-33X50I/MS: Tape and Reel, Low Noise, Positive-Regulated Charge Pump, Fixed Output MCP1253-33X50I/MS: Low Noise, Positive-Regulated Charge Pump, Fixed Output MCP1253-ADJI/MS: Low Noise, Positive-Regulated Charge Pump, Adjustable Output MCP1253T-ADJI/MS: Tape and Reel, Low Noise, Positive-Regulated Charge Pump, Adjustable Output a) b) Temperature Range: Package: MS = Plastic Micro Small Outline (MSOP), 8-lead c) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21752A-page15 MCP1252/3 NOTES: DS21752A-page 16 2002 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. DS21752A - page 17 M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. 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Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 15-16, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-82350361 Fax: 86-755-82366086 France Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 Germany Microchip Technology GmbH Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 11/15/02 DS21752A-page 18 2002 Microchip Technology Inc. |
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